Hi Zhiyan,

Try to reduce your post-exposure baking time. This will leave more solvent
in your SU8 during x-linking, enabling flow-induced stress relief and
hopefully fewer cracks.

Let us know the result!

Michael



>From: Zhiyan Liu 
>Subject: [mems-talk] Cracks on SU-8  during the development
>I am trying to use SU-8 with the thickness around 30um. But during the
>development in PGMEA, I found cracks created in the SU-8 . Mostly these
>cracks are originated from the corner of developed region and extend long
>into the SU-8.
>
>I am wondering if someone can give me a comment why these cracks generated
>and how to optimize the process.