Kristjan,

I'm not sure if that is correct.  Negative tone resists work by becoming
cross-linked (i.e., less soluble) when exposed to UV.  So, the flood
exposure process you described would just be re-exposing the regions
that were already exposed the first time around (since the pattern is
there due to the fact that it was exposed in the first round).

Best Regards,
Chad Brubaker

 -----Original Message-----
From: Kristjan Leosson
Subject: RE: [mems-talk] About Negative Photoresist

You can use maN-490 from www.microresist.de for film thickness in the
range 5-16um. Since it is a negative resist, you can use flood exposure on
the final pattern and remove it with your standard developer.  You can
also use organic solvents.