Jan,

Are you able to sputter etch your substrate in the vacuum system?  A few minutes
is a long time in HF.  What are you etching and could you use buffered HF
instead?

Brent

"Grahmann Jan" wrote:

I have a pad metallization consisting of 100nm Chromium and 300nm Gold.
Both are sputtered right after each other in vacuum. The problem is,
that I need to etch with 49%HF for a few minutes and the Cr-Au layer is
practically lifted off the siliconsubstrate. The Wafers were cleaned
before sputtering but have a native oxide layer. Does anyone know a
possibility to work with Cr-Au or another metallization which withstands
the HF? I need gold on top.