Hi Kris,
   Well you've done everything you should to get good adhesion, i.e. baking the
PI and a sputter etch just before deposition. At this point I would become
suspicious of the sputterer. Clean the interior of the chamber, it may be that
you are depositing something on your substrate during the sputter etch. That is,
something may be sputtering off of the substrate platen during the sputter-etch.
Are you reaching a descent base vacuum? Say at least 10^-5 Torr? Are you sure
you don't have a leak in the argon line? If air is getting into the chamber you
would of course oxidize the Ti and it will not stick to anything.

Good luck,
   Mike Martin
   U. of Louisville

>>> [email protected] 06/17/05 12:36 AM >>>
Hello,

I was sputtering Ti on Polyimide(PI2611). I did
presputter etch for a couple of minutes later followed
by thin Ti deposition and Au on top of it. The
substrate coated with PI was baked well and was
transferred to sputerrer immediately.

Ti does`nt stick well to the PI. AU peels of easily
with tape.