Dear All,

I have etched 20-25 micron wide and 450-500 um deep holes in silicon
wafer by DRIE process. Now, i have to cut them along the center of the
holes so that i can take the SEM pictures of their cross section.
Right now, i am cutting them manually (by simple diamond cutter) but
till now i am not able to cut them perfectly.

Can any body suggest any method, how i can cut such deep holes along
the diameter.

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Thanks,
Pradeep Dixit
Research Student,
Micromachine Center,
NTU Singapore - 639669