KOH solutions will slowly etch silicon dioxide. I'm guessing
that your "layer coated on the surface" is attached to the native
oxide of the silicon wafer. Etching away a nanometer or so of
SiO2 will remove whatever surface functionalization you've put on
there.

You might want to aminate after developing, or try using a milder
developer, i.e. dilute 1:4.

Tim Dellinger

On 11/3/05, Jeff chen  wrote:
>
> Hi, all,
>
> I am working on a project that needs to modify the silicon surface.
> Firstly I have a layer coated on the wafer, then spin coat AZ 1518 to
> do the lithography. After useing AZ developer, I found the bottom
> layer has some defects.
> Anyone knows the chemical content of the AZ developer?
> Does it deactivate the amin group?