Eric,

If you apply the diamond tip's along the substrate'(such as Si) crystal
orientation, the cracking line can be pretty trim and the side of the
substrate would be very smooth.

Kind of tricky, and you may not expect 100 percent success in this way.

Another way is CPM, higher possibility of success but more complicated.

Good luck,

Hongjun

------------------------------------
Hongjun Zeng, PhD
MEMS/Nano Scientist
Nanotechnology Core Facility
(NCF formerly MAL)
University of Illinois at Chicago

-----Original Message-----
From: Eric J. Correa
Sent: Monday, November 07, 2005 11:36 AM
To: [email protected]
Subject: [mems-talk] SEM Thickness Measurement

Hi Everyone:

I am trying to measure UNCD (diamond) thickness using a SEM
by looking at the cross sectional area.  I am using a
diamond tip to cut my samples but I am not able to get a
clean cross-sectional area.  I was just wondering if anyone
has any advice or recommendation.