Not sure if you found an answer. For the Ti/Cu/Cr
layer: Ti can only
be sputter/e-beam deposited. If you end your plating
base layer with
Cr, you may run into problems since Cr oxide has very
poor adhesion to
other layers. A Cr/Cu/Ni layer is definitely a
possibility, I use
similar plating bases quite often.
- Hide quoted text -

On 11/1/05, mathew varghese 
wrote:
> Hello evryone..
>   I'm attempting to fabricate a MEMS solenoid
inductor with a Cr/Cu/Ni plating base.Is this step
correct or should I use  a Ti/Cu/Cr combination.Could
some one please help me out in this matter and if
possible also tell me whether DC sputtering or
electroplating would be a good choice to deposit these
films?