Dear All,
   I want to etch several holes through the (110) Si wafer (200~300um
thick) with KOH for aligning the backside patterns to the front side. I
wonder if the size of the holes with a regular shape (square or
retangle) will affect the etching rate. What is the smallest size that
will still have a reasonable etching rates? (say in 20%~60% KOH at 80
degree C, the rate is greater than 100um/hour).

Thanks in advance!

HTao