A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: wafer level bonding
wafer level bonding
2005-12-20
Vikram Patil
2005-12-21
Shile
2005-12-20
Brubaker Chad
wafer level bonding
Brubaker Chad
2005-12-20
Bond strength can be measured by a tensile tester. Mount test samples
and pull from two opposite directions. A good reference Book is
Semiconductor Wafer Bonding by Tong and Gosele.

Best Regards,
Chad Brubaker


-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Vikram Patil
Sent: Monday, December 19, 2005 8:10 PM
To: [email protected]
Subject: [mems-talk] wafer level bonding

Hi all!
I am trying to gather some references for wafer level adhesive bonding.
Can
anyone tell me how much bonding strength is good? Or How does anyone
determine good bond stength value?
reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Nano-Master, Inc.
Tanner EDA by Mentor Graphics
MEMS Technology Review
Process Variations in Microsystems Manufacturing