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MEMSnet Home: MEMS-Talk: RE: SU-8 mold for Au electroplating
RE: SU-8 mold for Au electroplating
2005-12-20
Novak Farrington
RE: SU-8 mold for Au electroplating
Novak Farrington
2005-12-20
Jaesang Lee,

One thing you might try (if practicle with regards to sample size etc.) is to
use a teat-pipette to repeatedly direct jets of developer towards the via
openings. This may increase the circulation of fresh developer in the via
openings enough to remove all of the unwanted material.

Kind regards,

Novak


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