Dear all,

I am trying to use PI2610 and PI2737 polyimides as a sacrificial layer
between Al structural layer and silicon nitride base layer. When  I try
to remove polyimide with oxygen plasma, and try to actuate the Al
structural layer, it directly sticks down it just in one actuation
cycle. My question is:

Has anyone had any difficulties on removing PI polyimides from a SiN
surface? Can the polyimide residues be the reason for sticktion?

Thanks in advance,

Mehmet