Hi Frank,

Would you believe...

Nail polish?

Some associates of mine are using it to insulate gold wire bond wires from
mercury. They say most types work, except "glitter" nail polish.

Jesse Fowler

François Therriault Proulx  wrote:

Hi,
I'm a new subscriber to this mems-talk group and I'm not sure that my
message
has been sent the first time. Sorry if it's the second time you receive
it.

I'm looking for a kind of encapsulant to use with wire bonding. It is for
a MEMS
application. It should cover entirely wires. It has to insulate wires
electrically, but also be quite hard to accept pressure like a gentle
pushing of a finger. The material after cure has to become as wide as high
due
to wires specifications and alignment. It cannot cures at high
temperatures(maximum aroud 170 Celsius). I think that NoSweep from
Polyscience
should match my needs but I'm not sure. Does anyone know other products
that
could help me to solve my problem? Is NoSweep a good solution for my
problem?