Hi
Sounds like you got resist leftovers where you want your metal.
Try oxygen plasma before metal.

Shay

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Lung-hao Hu
Sent: Tuesday, March 21, 2006 1:47 AM
To: [email protected]
Subject: [mems-talk] AZP lift-off

I used AZP4620 and it AZ kwik striper remover to lift-off the metal
deposition but yield is too low. There are 64 sensors in one 3" wafer but
only 4~5 sensors are successful; the metal depostion of other devices are
gone.
I used thermal evaporate to deposit the Ti and Cu layers.
If I use S1813 to lift-off the metal layer; whether it comes out a better
result. The metal layers are 30nm of Ti and 0.3 um Cu.
I need your guys' experiences.