Hi all.
When dicing a silicon wafer, near the diced surface are produced defects
and, i think, silicon become amorphous. Thickness of damaged layer is
function of blade grit and dicing speed. Is there a way to delineate this
type of defects?
Could silicon defects delineation etches help? Can someone suggest me some
articles about silicon defects delineation etches?

For completely different tasks i'm interested also to germanium defects
delineation etches. Could someone suggest me articles?

Sorry for bad english,
thanks
Andrea