Martin,

After Ion mill try to use a O2/CF4(8%) plasma for a short exposure then
strip in Acetone.  This will work for some post mill process if you keep
the ion power down.

Ad Hall
StarCryoelectronics
505-424-6454
[email protected]


-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of Martin Aguilar
Sent: Thursday, July 20, 2006 10:25 AM
To: [email protected]
Subject: [mems-talk] Burned Photoresist

Hi,

I have a step in my RIE process where photoresist (S1813) is ion milled.
This causes burned fences all around the patterns on the wafer which are
really hard to remove. I read that you could try to RIE with O2 and then put
the wafer in a Nanostrip solution (piranha) but that will attack Al which I
have on my wafer...

Does anyone know about a process to get rid of the burned resist?