Think of vacuum baking at a normal hard bake temperature say 150 to 175
C. If you can provide heated Nitrogen heated to this temperature and
balance the delivery of Nitrogen against the vacuum pump to achieve a
steady flow of heated Nitrogen to warm the wafer surfaces more
effectively. Try to get a pressure of between 1 to 10 Torr and you will
pull all of the solvent out and hard bake the resist fully. If you
could use Sylilation you would get a crispy shell of Silicon that
retains resist shape at temperatures up to 400 C.
Bill Moffat, CEO
Yield Engineering Systems, Inc.
2185 Oakland Rd., San Jose, CA 95131
(408) 954-8353
-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Xiaoguang "Leo" Liu
Sent: Friday, September 01, 2006 8:28 AM
To: General MEMS discussion
Subject: Re: [mems-talk] contact angle measurement equipment needed
Thanks Bill
By vacuum bake, yuo mean baking the photoresist in vacuum at low
temperature?
Best
Leo
