Dear all,

Could anyone shed us a light to the problem?  I use Ti-Pt-Au on glass, which
is anodically bonded to silicon substrate with bad results, the metal
adhesion failed.  In the past, we had good results on the 4" wafers until we
switched to the 6".  We sputter- etched 500A of glass before depositing
Ti-Pt-Au.

Thank you,

John