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MEMSnet Home: MEMS-Talk: Au electroplating
Au electroplating
2007-05-09
kris
2007-05-09
David Nemeth
2007-05-10
Shay Kaplan
2007-05-10
P.E.M. Kuijpers
2007-05-10
David Nemeth
2007-05-10
David Roberts
2007-05-11
P.E.M. Kuijpers
2007-05-11
David Roberts
2007-05-14
P.E.M. Kuijpers
Miniature Hot Press for Plastic Microdevice bonding
2007-05-14
Heiko van der Linden
2007-05-14
David Roberts
2007-05-14
Mo Kebaili
Au electroplating
David Nemeth
2007-05-10
If the Ni is exposed to air, it oxidizes, causing bad adhesion.

If the nickel is evaporated or sputtered, put a 1000A of gold on top without
breaking vacuum.

If the nickel is electroplated, go directly from the nickel bath, into
water, than into the gold plating bath without letting the nickel surface
get dry.

This should fix your adhesion problems.

David Nemeth

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of P.E.M. Kuijpers
Sent: Thursday, May 10, 2007 1:50 AM
To: General MEMS discussion
Subject: Re: [mems-talk] Au electroplating

Hello Kris,

We did  also electroplating of Au (sulphite based)on Ni, but we observed a
very bad adhesion of Au onto the Ni seedlayer.
Did you observed this also or do you have a special pre-treatment to
overcome this?
reply
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