A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Adhesion layer for Nickel during Liftoff process
Adhesion layer for Nickel during Liftoff process
2007-05-12
madhav rao
2007-05-14
David Nemeth
Adhesion layer for Nickel during Liftoff process
madhav rao
2007-05-12
Hi All,
       I had sputtered Titanium layer. then I did spin
oat of PMMA. After exposing it (E-beam lithography),
Nickel was deposited using E-beam evaporation. Finally
Liftoff was carried out to remove PMMA. However after
liftoff, I could not see any Nickel and Titanium.
Please let me know, which is the better adhesive metal
for Nickel in Liftoff process.

Thanks

Regards,
Madhav.
MicroEp department,
Research Assistant,
University of Arkansas, fayetteville
reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
Nano-Master, Inc.
Addison Engineering
Tanner EDA by Mentor Graphics
Harrick Plasma, Inc.