Dear Leo,

My samples are 0.5mmx1mm with nearly 1/3 of bond area. You may call me
if you wish. We also done full wafer scale bonding for 4 inch wafers.

With our work pressure play a role but not the bonding time.

Regards

Heyshan MENDIS
+61 8 8259 5728

-----Original Message-----
From: Xiaoguang Liu [mailto:[email protected]]
Sent: Tuesday, 19 June 2007 12:46 AM
To: General MEMS discussion
Subject: Re: [mems-talk] Au-Au bonding

Dear Heyshan

That sounds like a simple process. I wonder how much bonding area you
had on the sample. I guess the pressure is really important. Thanks

Best
Leo

On 6/17/07, Mendis, Heyshan  wrote:
> We bonded some samples around 250-300C on our flip chip machine with
> around 5-10N force for 2-5min. Make sure both surfaces are oxide free.
> You also could enhance the strength by heat threatment around 300C for
> 0.5-1hrs.