Hello,

my name is Denis.
I am a Ph.D. student for IMSAS Uni Bremen.
I am going to try an electroplating process (approx. 10 µm of Ni) on a
ceramic substrate named above.
Has anybody done something like that?

I am going to sputter a seed layer of Cr-Au before electroplating
(plus approx. 100 nm of  Cu as a sacrificial layer for my future
freestanding Ni structures).
I have already successfully produced electroplated prestressed
Ni-structures on Si-substrates.

Is there anything I should specially conceard during the
electroplating on a caramic substrate?

Thanks in advance!

--
Denis Petrov
Ph.D. Student

Institute for Microsensors, -actuators and –systems (IMSAS)

University of Bremen

http://www.imsas.uni-bremen.de