Bob (and others),
I find that O2 plasma occasionally removes Cr and thin Au layers (~30
nm) in our Oxford Plasmalab 80 plus. I also use this chamber for SiNx
etching with CF4. I was interested in your response to another thread
that fluorine residues may be responsible for removing Cr- that may be
what is happening to me. What do you recommend as a cleaning method? Our
usual O2 / CF4 plasma clean doesn't seem appropriate in this case.

Regards
Jason Milne
Microelectronics Research Group
The University of Western Australia