A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Au electroplating on Cu seed layer
Au electroplating on Cu seed layer
2008-06-09
[email protected]
2008-06-09
shay kaplan
Au electroplating on Cu seed layer
shay kaplan
2008-06-09
You will have to electroplate (or electroless) nickel on the copper before
the gold.
Shay

-----Original Message-----
From: [email protected] [mailto:[email protected]]
On Behalf Of [email protected]
Sent: Monday, June 09, 2008 8:04 PM
To: [email protected]
Subject: [mems-talk] Au electroplating on Cu seed layer

Colleagues,

I'd like to  perform Au electroplating. For particular PVD reasons I cannot
provide  an Au-seed layer.
Since Cu forms an alloy with Au I was wondering weather it is feasible to
electroplate Au onto Cu.
Since I'm cautious with Gold I was wondering if you could provide me  with
some input in this matter before I start electroplating.
So far I'm planing to use a sulfite based Au-electrolyte since  CN-based
electrolytes might not be good with photoresists. The question  mark here is
how
the Cu behaves in such a solution and if it might  dissolve in the Sulfite
electrolyte etc....or if another solution might be  better....

I would appreciate any comments in that matter!
reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
The Branford Group
MEMS Technology Review
Process Variations in Microsystems Manufacturing
Tanner EDA by Mentor Graphics