My research is about the uniformity control of electroplating.

There's one conclusion of my research paper:

The uniformity and profiles of electroplated nickel
posts are controlled mainly by plating current density
and temperature. Optimal conditions of 8.05mA/cm2 and
20°C were obtained to fabricate flat cross-sectional
profile microstructures and a uniform thickness
distribution across a specimen.


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在2008-11-18，"Denis Petrov"  写道：
>Hello dear MEMS-Talk members!
>
>We are trying to electroplate 20-um thick copper over patterned 4-inch wafers.
>The problem is the uniformity of the Cu layer. If it is approx. 20 um
>in the middle of the wafer then we have something like 25 um at the
>edges.
>
>I found out that there is a device called an IBM Paddle Cell. Does
>anybody know anything about it? Is it of help in this case? Is there
>any other practical solution.
>We tried the rotating cathode method and we tried to agitate the
>solution with the rotating paddle. Did not help.
>
>Thank you!
>
>--
>M.Sc. Denis Petrov
>Ph.D. Student