I used 400-500 VDC, ~400 degC to bond a Si wafer with 6KA oxidized
silicon nitride to Pyrex.

Roger

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of jingru zhang
Sent: Friday, February 13, 2009 8:36 AM
To: General MEMS discussion
Subject: Re: [mems-talk] Silicon_Glass Fusion Bonding

Hi Roger,

Would you please specify the voltage that you used for bonding?
Is that the same as Gareth mentioned?

Thank you.

On Thu, Feb 12, 2009 at 5:31 PM, Roger Shile  wrote:

> The first time I did an anodic bond I used a hot plate and DC power
> supply that were lying around.  Just to be cute I used a coat hanger as
> an anode.
>
> The bonds were as good as what I get now using a very high priced
> commercial bonder.  I still get a lot of laughs over that hot plate and
> coat hanger.
>
> Roger