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MEMSnet Home: MEMS-Talk: Dry etching of Si
Dry etching of Si
2009-02-25
Alexandre BOE
2009-02-26
Jie Zou
2009-02-26
David Springer
2009-03-05
Alexandre BOE
2009-03-07
memser
Dry etching of Si
memser
2009-03-07
'Perhaps, some nice parameters (etching pressure and time cycle) can improve the
selectivity
(Si3N4 / Si) ?'
In our experiments, the follwing parameters are employed for protecting the
LPCVD Si3N4 film:
Etching Time Per Cycle: 60s/C, XeF2 pressure: 2-4Torr, N2: 60Torr.

Best regards!
Xu Yan
______________
State Key Lab of Transducer Technology,
Shanghai Institute of Microsystem and Information Technology,
Chinese Academy of Sciences
865 Changning Road, Shanghai 200050, China
Tel: +86-21-62511070 ext.8227 FAX: +86-21-62513510
Email:  
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