Hello all,

I was wondering if anyone has any experience etching copper using CE-200. I
am trying to use this chemical to spray etch Cu foils patterned using
Shipley resist (S1818). After the etch I see some serious undercut (close to
10um). The thickness of Cu is close to 1 mil (~25um). The etchant is at 35C
and further experiments are to increase the etchant temperature and check
the variation of the undercut. But was wondering if any of you has
experience working with this chemical or for that matter any copper etchant
that would give me lesser undercut.

Thanks,

Pavan Samudrala