I am trying to electroplate gold posts that are 50-100 microns wide using a KMPR
mold that is about 60-70 microns thick.  Using TG-25 electroplating solution I
have tried to electroplate at various current densities (1-10 mA/cm2) and have
tried DC, pulsed, and reverse pulsed plating.  I consistently get the same
results; “crown shaped” pins where very little gold is plated in the center of
the KMPR hole and the plating on the sides of the holes is much higher.

I have tried to ultrasonicate the chip in water before performing the plating to
remove any air bubbles that remain in the KMPR holes.  This seems to improve the
quality of the plating (the plating looks more yellow in color), but the pins
are still hollow. Perhaps I am not removing all the air from the holes?

Anyone run into this problem?  Any suggestions for a solution??

Thank you,
Parrish