Hi,

You can try cut it with laser for ex. femto-second laser to avoid the
demaged of the structure and also to have efficient accuracy.
But the time  of cutting is long and longer as much as the thickness of Si
increases as you want to save all properties of your sample.

Best Regards.

Karolina


From: Petru Lunca Popa 
To: General MEMS discussion 
Date: Tue, 23 Jun 2009 09:52:53 +0200
Subject: [mems-talk] Cutting Silicium pieces
Hi everyone

I am working with devices built by depositing Au on Si/SiO2 wafers .On
a 2cm/2cm piece of Si I am having 4 devices so I need to cut . Does
anyone can reccomand me a good and precise cutting machine?
I need a precision of half of milimeter (the distance between samples
is 1mm). Also I am performing some FIB or Ebeam on those samples so I
want to avoid strong vibrations.

So Anyone knows a good machine to cut ? Or a method what can help me?

Thank you
Petru