Hello everyone,

I am trying to do the lift-off process for the first time but am not able to
achieve it. Its been over 24 hrs that the wafer is immersed in acetone but the
gold film is not leaving the Si substrate.

Details of the process are:
I have spun SPR 220-3 on a SI wafer near 3 micron of a thickness. After exposing
and developing it, I sputtered 100 angstrom gold film.

Please guide me on how to do a lift off process. And if acetone is sufficient
for doing lift-off or do I need any other solvent or chemical?

Thanks
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