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MEMSnet Home: MEMS-Talk: metal coverage over ridge
metal coverage over ridge
2010-01-26
Barrios, Pedro
2010-01-26
Ruiz, Marcos Daniel (SENCOE)
2010-01-27
Paul Sunal
2010-01-27
Barrios, Pedro
2010-01-27
Paul Sunal
metal coverage over ridge
Barrios, Pedro
2010-01-27
This is an excellent idea. The only problem I see with this is that our e-beam
evaporation system in pumped -full blast- by a Cryo-pump. We would have to
retrofit the high-vacuum pumping assembly with a butterfly valve, or other type
of conductance control valve, to make it easier on the cryo-pump.

Thank you very much,

Pedro Barrios

-----Original Message-----
From: [email protected] [mailto:[email protected]] On
Behalf Of Paul Sunal
Sent: January 27, 2010 11:02 AM
To: General MEMS discussion
Subject: Re: [mems-talk] metal coverage over ridge

I would simply bleed nitrogen into the chamber and bring up the pressure
to result in a mean free path shorter than your source-substrate distance.
 The more multiples of mean free path to source-substrate distance, the
more conformal your coating will be.  Gold is relatively inert, therefore
having nitrogen in the background won't contaminate the film.

Rotating the substrate as you already do will help as well during this
high)er) pressure evaporation.

Best of luck,

Paul

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