Diep,

I think the Au layer should be needed since it is a very solderable surface
while the Pt tends to be oxidized leading the solderability issues.

Thank you and best regards,

 JTD

-----Original Message-----
From: [email protected]
[mailto:[email protected]] On Behalf Of Buu
Diep
Sent: Wednesday, March 10, 2010 6:28 PM
To: [email protected]
Subject: [mems-talk] Pt as oxidation protection

Hello,

Has anyone successfully tried Ti/Pt base metal for AuSn20 bonding instead of
the Ti/Pt/Au stack?

Regards,

Buu Diep