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MEMSnet Home: MEMS-Talk: Front-side protection material for SOI backside DRIE etching
Front-side protection material for SOI backside DRIE etching
2010-03-25
Li. Zhang
2010-04-07
Karolina psychowlosy
2010-04-10
Li. Zhang
2010-04-20
Karolina
Front-side protection material for SOI backside DRIE etching
Li. Zhang
2010-04-10
Hi Karolina,

I also use Alcatel DRIE machine and standard Bosch process with Al mask. I
applied a 3-um thick PR as front-side protection material after performed
front-side etching. Actually it works. But I met some problem when releasing
the BOX layer. Sometime the thin BOX film just broke and the device got
damaged.

Have you ever seen such a structure releasing problem? Do you have any
suggestion? Very much appreciate it!

Li. Zhang
---------
Graduate Student
Edward P. Fitts Department of Industrial and Systems Engineering
North Carolina State University
Raleigh, NC 27695-7906
USA
TEL: (919) 413-5459
Email: [email protected]
Web:  http://www.ise.ncsu.edu
         http://www.nnf.ncsu.edu
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