Hi All,

Just have a question about removing polyimide from an Si Wafer and wanted to
know if anyone had experience with this? I would spin and bake the PI on the
wafer. After fabricating the device I wanted to peel the PI with the device of
the wafer (so it is on a flexible substrate)

Are there any special tricks or rigs that you use?

Any help I am sure would be very useful

Thanks,

Darren Alvares
Graduate Student
Graduate School of Biomedical Engineering
University of New South Wales
UNSW Sydney NSW 2052 Australia
[email protected]