I used to pattern Pyrex for bonding with SOI and it works OK
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From: Darren Alvares
To: "[email protected]"
Sent: Tue, June 29, 2010 5:16:47 AM
Subject: [mems-talk] Glass Substrate Or Not
Hi All,
I am toying with the idea of using glass as a substrate for my application. I
was wondering if anyone has any insights into the challenges of doing this.
* I will be spinning and baking polyimide PI2525.
* I will then pattern photoresist AZ6632
* Evaporate Ti/Au 10/100nm and then perform lift-off using NMP.
After some additional steps I would like to peel the polyimide with the device
of the glass substrate. I am assuming the polyimide glass interaction should be
the same as the polyimide SiO2 interaction. A few people have confirmed in
earlier posts that I can do this.
Thanks,
Darren Alvares