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MEMSnet Home: MEMS-Talk: Temporary adhesive for spin coating
Temporary adhesive for spin coating
2010-08-26
Gareth Jenkins
2010-08-26
Alex Mellnik
2010-08-27
Gareth Jenkins
2010-08-30
James Paul Grant
2010-08-31
Gareth Jenkins
2010-08-31
James Paul Grant
2010-08-31
Wilson, Thomas
2010-09-03
Gareth Jenkins
Temporary adhesive for spin coating
Wilson, Thomas
2010-08-31
Alternatively, you could place your wafer on a hot plate and let it heat up to
54C (flow point of CrystalBond), take your CB stick and touch it to the wafer
location in question - you'll get a dab of liquid CB at that spot, then just
place your chip on this position and then remove the wafer from the hotplate.
Upon cooling, the two will be quite firmly bonded. Any further photoresist
softbakes/post-bakes would again cause the CB to flow, but doubt if your chip
would move during same. Your chip will easily float off the wafer in an acetone
soak when you're finished. Of course, if the final acetone soak could not be
allowed, then this CB approach won't work.

Thomas
reply
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