A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Au/Ti adhesion problem
Au/Ti adhesion problem
2010-12-03
Binh Tran
2010-12-03
Yingnan Wang
2010-12-03
Andrew Sarangan
2010-12-09
Ned Flanders
2010-12-03
Ruiz, Marcos Daniel (SENCOE)
Au/Ti adhesion problem
Yingnan Wang
2010-12-03
Hello Binh,

Must the layer be Au/Ti only? If not, I think you can sputter Cr on your glass
wafer first, then your desired layers.

Cr offers a better adhesion on glass wafer. Hope this can help you.

BR,
YN WANG

> Date: Thu, 2 Dec 2010 20:06:02 -0800
> From: [email protected]
> To: [email protected]
> Subject: [mems-talk] Au/Ti adhesion problem
>
> Hi all
>
> I'm having a problem with the Au/Ti adhesion on glass wafer as follow :
>
> I had finished the Au/Ti coating process on the glass wafer (piranha treated),
there is no problem. Then I used some of them for my experiment at that time
(the adhesion was good) and kept the others for the later use.
>
> After a few days when I used the others and there was a problem with the Au/Ti
layer. They became sensitive and easily peel off even when washing with DI
water. I don't know why there is a different adhesion between the first and the
second time using. Does anyone face this problem before ?
>
> Thank you
>
> Binh Tran
reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
MEMStaff Inc.
Nano-Master, Inc.
Process Variations in Microsystems Manufacturing
The Branford Group