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MEMSnet Home: MEMS-Talk: Au/Ti adhesion problem
Au/Ti adhesion problem
2010-12-03
Binh Tran
2010-12-03
Yingnan Wang
2010-12-03
Andrew Sarangan
2010-12-09
Ned Flanders
2010-12-03
Ruiz, Marcos Daniel (SENCOE)
Au/Ti adhesion problem
Ned Flanders
2010-12-09
Hey Binh,

another vote for Cr adhesion layer. Or you could try W-10Ti, if you
have such a target (works great as Au adhesion layer).

By the way, what is the thickness of this gold layer?

cheers

m

On 12/3/10, Andrew Sarangan  wrote:
> A thin layer of Cr helps the adhesion of Au. However, your peeling
> issue could be due to a number of other causes. How were these films
> produced - evaporation, magnetron, sputtering.. Mag sputtering under
> low pressure can lead to excessive compressive stress which can cause
> buckling delaminations. Evaporated films can have tensile stress and
> lead to void defects. Stresses can also develop due to absorption of
> moisture in evaporated films. You should be able to determine if the
> stress is compressive or tensile by examining the peeling regions.
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