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MEMSnet Home: MEMS-Talk: Adhesion problem during 7740 glass wafer wet etching process
Adhesion problem during 7740 glass wafer wet etching process
2010-12-13
Xin Yan
2010-12-13
Zijian Cao
2010-12-13
Shay Kaplan
2010-12-14
Xin Yan
2010-12-13
Andrew Sarangan
2010-12-13
Mikael Evander
2010-12-14
Xin Yan
2010-12-14
Mikael Evander
2010-12-15
Xin Yan
2010-12-14
Xin Yan
2010-12-16
Andrew Sarangan
2010-12-15
Ned Flanders
Adhesion problem during 7740 glass wafer wet etching process
Ned Flanders
2010-12-15
My experience is exactly the opposite, sputtered Cr having less
pinholes than evaporated.

On 12/13/10, Andrew Sarangan  wrote:
> Most likely Cr has pin holes in the film and the HF is penetrating
> through it. Sputtered Cr is particularly prone to developing pin
> holes. I've had better luck with evaporated Cr.
reply
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