A MEMS Clearinghouse® and information portal
for the MEMS and Nanotechnology community
RegisterSign-In
MEMSnet Home About Us What is MEMS? Beginner's Guide Discussion Groups Advertise Here
News
MEMSnet Home: MEMS-Talk: Adhesion problem during 7740 glass wafer wet etching process
Adhesion problem during 7740 glass wafer wet etching process
2010-12-13
Xin Yan
2010-12-13
Zijian Cao
2010-12-13
Shay Kaplan
2010-12-14
Xin Yan
2010-12-13
Andrew Sarangan
2010-12-13
Mikael Evander
2010-12-14
Xin Yan
2010-12-14
Mikael Evander
2010-12-15
Xin Yan
2010-12-14
Xin Yan
2010-12-16
Andrew Sarangan
2010-12-15
Ned Flanders
Adhesion problem during 7740 glass wafer wet etching process
Andrew Sarangan
2010-12-16
You can try adjusting the argon pressure. Low pressure tends to give
dense films with compressive strain which can lead to buckle
delamination.


On Tue, Dec 14, 2010 at 12:44 AM, Xin Yan  wrote:
> thank you Andrew,  I also think the sputtering Cr film should have lots of
> problem. But the Sputtering is the only way to deposit Cr in our lab.  i
> think what if i  change the recipe of the sputtering, the film could become
> more dense.
>
reply
Events
Glossary
Materials
Links
MEMS-talk
Terms of Use | Contact Us | Search
MEMS Exchange
MEMS Industry Group
Coventor
Harrick Plasma
Tanner EDA
MEMStaff Inc.
Mentor Graphics Corporation
Nano-Master, Inc.
The Branford Group