Dear all,

I am using su-8 in photolithography technique. I'm having difficulty when
handling it.

The adhesion strength of su-8 and silicon is not very even.  I clean the silicon
wafer in piranha solution, give it a oxygen plasma treatment and use the Mcc
primer (microchem).
After 1.5 minutes developing some patterns will peel off.   M mask dimension is
only 10microns.

Has anybody encountered this problem?

Is the adhesion strength decided by the softbake time or post bake time or both?
Should I increase the baking time for both?

Any suggestions will be highly appreciated.

Thanks a lot in advance.