Hello All,

Anyone out there have experience with PerMX 3020 (negative tone resist) dry
film photoresist from Dupont?

Previously, I have successfully used other PerMX 3000 series resists such as
3015 and 3050. However I am facing strange problem with 3020 resist. The
exposed/crosslinked resist  area shown number of blisters and through holes.
My recipe for the PerMX 3020 is as follows:

Cleaning of Wafer: Acetone, IPA, Nitrogen dry
Dehydration: 180 deg. C for 20 min.
Laminator parameter: roller temperature 75 deg C with slowest roller speed
possible with our laminator.
Pre Exposure Bake: 95 degree C for 4 min
Exposure: 300 mj/cm2 and 400 mj/cm2
Post Exposure Bake: 95 degree C for 4 min (this is when I usually see
formation of blisters and holes)
Development: 5 min in PGMEA

Any help in this regards will be deeply appreciated.

Best regards

Amit
--
Dr. Amit Asthana
Senior Research Officer
Australian National Fabrication Facility(QLD Node)
Australian Institute of Bioengineering and Nanotechnology
The University of Queensland, Building 75, Room 260,
QLD 4072 Australia
Phone: +61 (0) 7 3346 3429(Office)
            +61 (0) 7 3217 0425 (Home)
            +61 (0) 432096210 (Cell)
Email: [email protected]
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