Hi,

I am trying to use positive resist as a sacrificial layer for releasing the
entire SU8 sheet (22mmx22mm) from my glass substrate. After postbaking the
combination, I observed bubbles in the resist layer. I used AZ400k to dissolve
the positive resist after developing SU8 but it did not come off. Anyone have
any experience in this?

Thanks a lot.

Regards,

Sumit