Hi All,

We sputtered CrAu metal films onto a layer of silicon dioxide on the topside of
silicon wafers, then thickened the Au film by electroplating to about 3 microns.
We did the film adhesion test by spot-wielding Au tape and pulling the Au tape.
Sometimes the film under the wield spot were pull off, sometimes not. While
doing the Ultrasonic/Thermosonic  tape bonding and pulling test, it shows that
the film adhesion is good.
It seems that Some batch of CrAu films couldn't bear temprature shock by spot-
wielding.
How could we improve the tolerance of CrAu films to high temperature shock?
Does anyone has the similar experience?

Thanks!