we are trying to put a nichrome heater on top of e-beam evaported SiO2
(200 nm) which is on top of a gold pad. between the gold pad and the oxide
is a 10 nm nichrome adhesion layer. the problem is that when we perform
the etching for the heater, there are holes formed on the nichrome
adhesion layer which can be seen through the SiO2 layer. Is there a way of
getting around this porblem? or is SiO2 just so so porous that this will
always happen? are that any other insulating layers that can be used?

any suggestions will be appreciated.
thanks in advance.

Marc Llaguno
University of Pennsylvania