Hi,

   Currently we are working on the development of silica qr resist in
nanoimprint lithography for selective etching of silicon.

How we do it:

1. put few drops of the silica solution on the si wafer, then because of its
low viscousity and less surface energy, the liquid flows very quickly when
printed.

2. imprinting temp 100deg for a pressure of 1.3MPa

Technical questions:

1. how generally silica resist is spun for imprint, what is viscosity of
the liquid when spun, we couldn't optimise the thickness of the prepared film,
problems in uniformity when dropped.

2. when PDMS is used as stamp, the pressure increase than the pressure
applied automatically, why is that, is it because of the thermal coefficient
of the Stamp?

3. how are these things done in general. In terms of handling and also
viscosity values.

Thanks for the help, looking forward to some answers.

Regards,
Righeira
IMEC, Belgium