Hi, Ashok
What is the aspect ratio of your TSV structure? You may try SF6+O2 process with
oxide as mask.
The profile will be sacrificed although with non-bosch process.
Regards!
Lillian

-----Original Message-----
From: Ashok . [mailto:[email protected]]
Sent: Wednesday, May 03, 2017 3:46 PM
To: [email protected]
Subject: [mems-talk] Through Silicon Via using Non-Bosch recipe

Dear mems-talk community,

I am using SPTS(Orbotech) DRIE ICP etcher for etching TSV but using Bosch
process. since my device process' requirements are with scallops < 20nm,  I am
looking for a recipe (non-bosch) which uses both Etch and Depo steps
simultaneously.
Could you please guide me in this about the possibility of developing the same?

Thanks in advance,
Regards,

Ashok Kumar D,
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provider of MEMS and Nanotechnology design and fabrication services.
Visit us at http://www.mems-exchange.org

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