Hello,

I have had a similar problem while electroplating copper. This usually
happens due to small air bubbles forming on your high aspect ratio features
which act as masks against electroplating. The bubbles are formed when you
immerse a dry wafer into the electroplating solution.

I was able to solve this my doing a DI water rinse on my wafer prior to
electroplating. Wet the wafer, and immerse the wet wafer into the
electroplating bath without letting the water dry. This prevented the
micro-air bubbles and gave me consistent electroplating across the wafer.

Thanks,
Rugved
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