Hello,

You can not make very general statements about stress in either sputter
deposited or evaporated metal films. Typically, evaporated films tend to
have high stress values.
With sputterering you can much better influence it via process
conditions - primarily the
gas pressure. You might obtain any kind of stress: high,low,tensile or
compressive, depending
on the sputtering conditions.
There are well reviewed articles in literature:
e.g.:
J. A. Thornton in
Bunshah, Rointan F. Handbook of Deposition Technologies for Films and
Coatings: Science,
    Technology, and Applications, Second Edition. Noyes Publications.
New Jersey. 1991.
or other publications by Thornton/D.W. Hoffman

Best regards, Thomas Ammer

_____________________________________________
Thomas Ammer
CSEM SA Zürich      Tel:  +41 1497 1434
Micro-Optics             Fax:  +41 1491 6323
Badenerstrasse 569
8084 Zürich/Switzerland